We have introduced High-speed Automated X-Ray Inspection System VT-X700.
Inspects the soldering for BGA and other bottom-side terminal components. Uses x-ray CT, making it ideal for solder joints.
The VT-X700 addresses the three issues of reliability, productivity and ease of use by using CT imaging to locate defects in three dimensions. Omron’s three innovations-automated inspection using specially designed algorithms, high-speed performance that supports inline inspection, and a user-friendly GUI-all combine to significantly boost inspection efficiency for components that are normally difficult to screen for defects.