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Application No.80

Measures Height and Width of Chip Electrode Foaming



Height and width errors in foaming rise are measured together within the line beam.

Application No.84

Detects the Peaks of Minute Rivets



Multiple measurements can be made within the line beam, so the peaks of rivets can be measured from a reference surface with good stability.

Application No.85

Detects PCB Warping with a Single Measurement



Three-point height differences can be measured within the line beam, for PCB warping detection with a single measurement.

Application No.125

Inspects the Profile of Cast Components



Scanning with the wide laser enables measurement of the cross-sectional shape without having to move the workpiece.