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VT-X700-E / -L

High-speed automated X-ray CT inspection system

VT-X700-E / -L

The 3D-CT method enables the inspection of indistinct shapes which 2D or pseudo CT cannot detect. Making the impossible in design a reality!

Hardware configuration/function specifications

Item Description
Model VT-X700-E VT-X700-L
Inspected components BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips,
bottom-side terminal components, QFN, Power devices
Inspected items Openings, non-wet, solder amount, shifting, foreign object stuck,
bridging, lead presence, etc. (selectable to suit detected item)
Imaging
specifications
Imaging method 3D-slice imaging using parallel CT
Resolution 10, 15, 20, 25 or 30 μm (selectable to suit detected item)
X-ray source Micro-focus closed tube (130 kV)
X-ray detector Flat panel detector
Inspected
PCBs
Size M-size PCB (50 mm x 50 mm to
330 mm x 255 mm);
thickness: 0.4 mm to 3.0 mm
PCB (50 mm x 50 mm to
610 mm x 610 mm);
thickness: 0.6 mm to 7.0 mm
Weight 2.0 kg or lighter
(with components mounted)
12.0 kg or lighter
(with components mounted)
Mounted component height Top: 50 mm or shorter; bottom: 20 mm or shorter
Warpage/Flexure 2.0 mm or less 3.0 mm or less
Device
specifications
Dimensions 1,550(W) x 1,650(D) x 1,620(H)mm 2,180 (W) x 2,500 (D) x 1,720 (H) mm
Weight Approx. 2,920 kg Approx. 5,250 kg
PCB transfer height 900±15 mm
Power supply voltage Single phase,
200/210/220/230/240 VAC (± 10%),
50/60 Hz
3 phase, 200/210/220/230/240 VAC,
380/405/415/440 VAC (± 10%),
50/60 Hz
Rated power 3.1 kVA 4.7 kVA
X-ray leakage Less than 0.5 μSv/h