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The VT-S7 series features 3D-SJI based on high-accuracy solder shape restoration.
Accurate quantitative inspection of solder bondability is now possible, greatly contributing to quality control requirements conforming to international standards such as IATF (ISO/TS)16949.
VT-S530
PCB Inspection System
Featuring High Productivity and High Resolution. Introducing a New Model in the VT-S 3D-SJI Series!
about this Product Family
Related Contents
- Power Supplies / In Addition
- Inspection System
- Features
- Lineup
- Specifications
- Dimensions
- Catalog
last update: January 15, 2018
High-precision Soldering Inspection [In common with VT-S730]
High-resolution inspection
With engineering specifications and high resolution compatible with the SEMI industry, the VT-S530 provides stable inspection of 0402/0603 microchip components!
High-productivity Inspection
The VT-S530 supports dual lane operation for higher production throughput.
Dual lane operation using various PCBs is possible, due to its handling capability up to the PCB size of 510 (W) x 330 (D) mm.
last update: January 15, 2018
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