Global
| Item | Description | |||
|---|---|---|---|---|
| Model | VT-X750 | VT-X750-XL | ||
| Type | V3-H | V3-C | V3 | |
| Inspection object | BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal
components, QFN, Power devices, POP, Press-fit CN, etc. |
|||
| Inspection items | Void, open, non-wet, Solder Volume, shifting, foreign object, bridging, Solder fillet,
TH Solder filling, Solder ball, etc. (selectable to applications) |
|||
| Imaging
system |
Method | 3D-slice imaging by using parallel CT | ||
| Resolution | 6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program) |
3,6,8,10,15,20,25,30μm/pixel
(selectable in the inspection program) |
10,15,20,25,30µm/pixel
(selectable in the inspection program) |
|
| X-ray source | Micro-fucus closed tube | |||
| X-ray detector | Flat panel detector | |||
| PCBA | Size | 50x50~610x515 mm (2x2 to 24x20 inch),
Thickness: 0.4~5.0mm (0.4~3.0mm in 3 µm resolution) |
100 x 100~1200 x 660 mm,
Thickness: 0.4~15.0 mm |
|
| Weight | Less than 4.0 kg, Less than 10.0 kg (option) (*1) | Less than 15 kg | ||
| Component
clearance |
Maximum top: 40 mm, 90 mm (option) (*1),
Maximum bottom: 40 mm |
Top: 40 mm, Bottom: 50 mm | ||
| Warpage | Less than 2.0 mm (Less than 1.0 mm in 3 µm resolution) | Less than 3.0 mm | ||
| Main
body |
Footprint | 1,550(W) x 1,925(D) x 1,645(H) mm | 2,180(W) x 2,510(D) x 1,735(H) mm | |
| Weight | Approx. 3,100 kg | Approx. 5,350 kg | ||
| Conveyor
height |
900 ±20 mm | |||
| Power supply | Single phase, 200 to 240 VAC, 50/60 Hz | |||
| Rated power | 2.4kVA | 2.58kVA | ||
| X-ray leakage | Less than 0.5 µSv/h | |||
| Air supply | 0.4 to 0.6 Mpa | |||
| Safety
standard |
CE, SEMI, NFPA, FDA | CE, FDA | ||
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