Item | Description | |||
---|---|---|---|---|
Model | VT-X750 | VT-X750-XL | ||
Type | V3-H | V3-C | V3 | |
Inspection object | BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal
components, QFN, Power devices, POP, Press-fit CN, etc. |
|||
Inspection items | Void, open, non-wet, Solder Volume, shifting, foreign object, bridging, Solder fillet,
TH Solder filling, Solder ball, etc. (selectable to applications) |
|||
Imaging
system |
Method | 3D-slice imaging by using parallel CT | ||
Resolution | 6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program) |
3, 6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program) |
10,15,20,25,30µm/pixel
(selectable in the inspection program) |
|
X-ray source | Micro-fucus closed tube | |||
X-ray detector | Flat panel detector | |||
PCBA | Size | 50x50~610x515 mm (2x2 to 24x20 inch),
Thickness:0.4~5.0 mm (0.4~3.0 mm in 3 µm resolution) |
100x100~1200x660 mm,
Thickness:0.4~15.0 mm |
|
Weight | Less than 4.0 kg, less than 8.0 kg (option) | Less than 15 kg | ||
Component
clearance *Maximum |
Top: 40 mm, 90 mm (option) | Top: 40 mm, Bottom: 50 mm | ||
Warpage | Less than 2.0 mm (Less than 1.0 mm in 3 µm resolution) | Less than 3.0 mm | ||
Main
body |
Footprint | 1,550(W) x 1,925(D) x 1,645(H) mm | 2,180(W)×2,510(D)×1,735(H) mm | |
Weight | Approx. 3,100 kg | Approx. 5,350 kg | ||
Conveyor
height |
900 ±20 mm | |||
Power supply | Single phase, 200 to 240 VAC, 50/60 Hz | |||
Rated power | 2.4kVA | 2.58kVA | ||
X-ray leakage | Less than 0.5 µSv/h | |||
Air supply | 0.4 to 0.6 Mpa | |||
Safety
standard |
CE, SEMI, NFPA, FDA | CE, FDA |