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VT-X750

High-speed automated X-ray CT inspection system

VT-X750

In-line Full Inspection System

Hardware configuration / Function

Description
Model VT-X750
Inspection object BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices
Inspection items Void, open, non-wet, solder amount, shifting, foreign object, bridging, lead presence, etc. (selectable to applications)
Imaging
system
Method 3D-slice imaging by using parallel CT
Resolution 6, 8, 10, 15, 20, 25 or 30 μm/pixel (selectable in the inspection program)
X-ray source Micro-focus closed tube (130 kV)
X-ray detector Flat panel detector
PCBA Size 50 x 50 to 610 x 515 mm (2 x 2 to 24 x 20 inch) , Thickness: 0.4 to 5.0 mm
Weight Less than 4.0 kg (with component mounted)
Component clearance Top: Less than 50 mm, Bottom: Less than 40 mm
Warpage Less than 2.0 mm
Main body Footprint 1,550(W) x 1,925(D) x 1,645(H) mm
Weight Approx. 2,970 kg
Conveyor height 900 ±15 mm
Power supply Single phase, 200 to 240 VAC, 50/60 Hz
Rated power 2.4 kVA
X-ray leakage Less than 0.5 μSv/h
Air supply 0.4 to 0.6 Mpa
Safety standard CE, SEMI, NFPA, FDA