Page top

CK3W-GC[][]00

CK3W Laser Interface Unit

CK3W-GC[][]00

High-speed laser ON/OFF and multi-head configuration for ultra-high-speed, high-precision processing

Minimize laser ON/OFF commissioning time by balancing high-throughput and high-quality laser processing

Reducing commissioning time by target position-based Laser ON/OFF

[Conventional] Adjusting laser ON/OFF timing by delay time takes long time (about 10 to 15 days*1).

Time-based ON/OFF setting requires calculation for motion behavior parameters (e.g., acceleration, deceleration and laser response time).
Adjustment of delay time for each parameters requires repeating try and error testing until the target performance is achieved.

CK3W-GC[][]00 Features 3

[CK3W-GC] Laser ON/OFF timing can be set easily by using target position value directly (about 2 to 3 days*1 to complete which reduces adjustment time by 80%*2).

The target performance can be achieved by simply setting target laser ON/OFF timing by target position value without considering time-related settings (e.g., acceleration and deceleration).

CK3W-GC[][]00 Features 4

Easy multiple parts manufacturing

[Conventional] Adjusting laser ON/OFF timing takes long time when multiple same shape parts are processed simultaneously (about 15 to 20 days*1).

One laser controller is installed for one scanner head for each part processing to configure multiple parts manufacturing. Errors among processed parts will occur as the instructions of controllers are not synchronized. Each scanner head needs to be adjusted and to compensate these errors by try and error approach, which increases adjustment time in proportion to the number of the scanner heads.

CK3W-GC[][]00 Features 6

[CK3W-GC] Easy multiple parts manufacturing without considering of errors among controllers (about 2 to 3 days*1 to complete which reduces adjustment time by 90%*2).

Synchronized operations of multiple CK3W-GC enable precise processing of multiple parts without the need to adjust the scanner heads. Even if the number of the scan heads increases, multiple parts can be processed easily.

CK3W-GC[][]00 Features 7

*1. Omron survey.
*2. Performance comparison with previous Omron products.

Improving machine throughput by synchronizing laser output and stage movement

[Conventional] Throughput gets worse as a part must be processed after the stage stops

Large-area profiling in FPD and other manufacturing typically uses the step-and-repeat method. In this method, the stage is moved to the irradiation area of the scan head, and then laser processing is performed. Stage stopping time makes the throughput worse.

CK3W-GC[][]00 Features 10

[CK3W-GC] High throughput can be achieved by processing parts on the moving stage

The CK Series uses the on-the-fly control method to perform laser processing while moving the stage. This method can reduce the time required to stop the stage, improving throughput by approximately 35% compared to the step-and-repeat method.

CK3W-GC[][]00 Features 11

System configuration

CK3W-GC[][]00 Features 12