Global
| Type | VT-S1080-V2.0 | VT-S1040-V2.0 | VT-Z600-V2.0 | |
|---|---|---|---|---|
| Outer dimentions | 1180(W) x 1450(D) x 1500(H)mm (excluding tower lamp and monitor) | |||
| Weight | Approx. 1240Kg | |||
| Power supply | 200 to 240 V AC (Single phase); Voltage fluctuation range ±10% 50/60Hz | |||
| Rated power | 2.0 kVA (Maximum current 10 A) | |||
| Line height | 900±20mm | |||
| Air supply | Not required | |||
| Operating temperature
range |
10～35℃ | |||
| Operating humidity
range |
35 to 80% RH (Non-condensing) | |||
| Camera | Direct | 25Mpix | ||
| Oblique | 5Mpix | - | - | |
| Resolution | Direct | 12.5μm | ||
| Oblique | 10μm | - | - | |
| FOV | Direct | 52.5 x 52.5mm | ||
| Oblique | 25.9 x 19.4mm | - | - | |
| Inspection principle | Hybrid 3DShape
reconstruction MDMC*12 illumination+Phase shift (MPS *13) |
Hybrid 3DShape
reconstruction MDMC*12 illumination+Phase shift (MPS *13*14) |
2.5D Shape reconstruction
MDMC*12 illumination |
|
| Supported
PCB size |
Size | Single lane: 50(W) x 50(D)～510(W) x 680(D)mm
Dual lane: 50(W) x 50(D)～510(W) x 330(D)mm |
||
| Thickness | 0.4～4mm | |||
| Weight | 4Kg | |||
| Clearance | Clearance on PCB: 50mm from board surface
Clearance under PCB: 50mm from the back of the board (including PCB warpage, deflection, component tolerance, etc.) |
|||
| Height measurement
range |
25.4mm | - | ||
| Inspection item | Component height, lift, tilt, missing or wrong component,
wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet*15 (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle |
Missing or wrong component,
wrong polarity, flipped component, OCR inspection, 2Dcode, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length)*15, exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle |
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