• Downsizing package
• Higher density with stacked layer
• Variety of device combination (SiP)
High speed automated X-ray CT inspection system For SEMICONDUCTOR
last update: March 2, 2015
• Downsizing package
• Higher density with stacked layer
• Variety of device combination (SiP)
Omron’s proven 3D-CT technology leads through
- Fast and Quantitative metrology
- Stable Imaging with Sub-Micron Magnification
- Recipe-based Automated Inspection
last update: March 2, 2015