Page top

VT-X700 / VT-X900

High speed automated X-ray CT inspection system For SEMICONDUCTOR

VT-X700 / VT-X900

Omron‘s unique Automated inspection capability ensures process quality in a mass-production environment by using Submicron CT imaging with a variety of Metrology data.

Hardware configuration/function specifications

Item Description
Model VT-X700-M VT-X900
Imaging method Parallel CT, 3D slice imaging
Imaging resolution 10, 15, 20, 25, 30 μm 0.3, 0.5, 0.7, 1.0, 2.0, 3.0 μm
Max. Inspection area 330 mm x 255 mm 330 mm x 330 mm
Source 110 kV closed tube 110 kV open tube
Detector 5M pixels flat panel detector 4M pixels I.I. camera
Dimension 1,550(W) x 1,650(D) x 1,620(H) mm 2,271(W) x 1,707(D) x 1,889(H) mm
Weight Approx. 2,900 kg Approx. 3,300 kg
Rated voltage Single phase 200/210/220/230/240 VAC (±10%) Single phase 200/208/220/230/240 VAC (±10%)
Rated power 2.9 kVA 6.0 kVA
Oil free air 0.4 to 0.6 MPa 0.4 to 0.6 MPa
X-Ray leakage < 0.5 μSv/hr < 0.5 μSv/hr
Standard CE, SEMI S2/S8, SECS/GEM, NFPA79, FDA

*The specification subject to change without notice.